efinix
Titanium Ti60 FPGA
Ti60F225C4
Titanium Ti60 delivers high logic density with hardened DSP, 25 Gb/s SERDES and MIPI interfaces in a small package.
Add this part to your quote list to request several line items together, or send the ordering code directly and we will confirm the available lot, packaging and date code.
Key specifications
| Logic elements | 62,000 |
|---|---|
| SERDES | Up to 25 Gb/s |
| Hard IP | MIPI D-PHY, DDR4/LPDDR4 controller |
| DSP | 1,000 blocks (18 × 19) |
| Package | FBGA-225 |
| Configuration | Quad SPI / JTAG |
Titanium for interface-heavy designs
The Titanium family hardens the interfaces that would otherwise consume fabric: MIPI D-PHY for camera input, DDR controllers for frame memory, and DSP blocks for the arithmetic between them. Ti60 is the mid-point of the family.
- Hard MIPI D-PHY receivers for direct camera connection
- DDR4 and LPDDR4 hard controllers
- Efinity toolchain with an integrated debugger
Typical applications
Ordering information
- Supplied in original manufacturer packaging unless otherwise agreed in writing.
- Lot, date code and packaging option are confirmed on the quotation for each line.
- Minimum order quantity may apply to low-volume order codes — ask if you are unsure.
- Volume, OEM and scheduled-release pricing available on request.
Quality assurance
Every incoming lot passes our standard inspection protocol before it is offered for sale:
- Documentation and traceability review against the approved source
- Visual inspection of marking, packaging and lead condition
- X-ray or decapsulation where authenticity cannot be established externally
- Electrical verification on request, quoted per line
Inspection evidence is retained against the lot number and can be supplied with the shipment when your process requires it.
Shipping & returns
- Worldwide dispatch with tracking; express courier available for urgent lines.
- Counterfeit parts are refunded in full, including freight, per our published policy.
Design-in support
Our engineering team supports the parts we supply. That includes pin-out and power questions, device selection against an existing design, and bringing up reference designs on the hardware you buy from us.
- Device and package selection against cost, power and IO requirements
- Carrier board and thermal design review for module-based designs
- Cross-reference and second-source proposals for allocation-constrained parts
- Toolchain setup guidance for AMD, Altera, Lattice, Microchip and Efinix flows
Send us your requirement
Describe the application, the interfaces and the environment. We reply with a shortlist of suitable parts and their availability.
Contact engineering