Device & package selection
We match logic density, DSP count, transceiver lanes and package against your board constraints — including where a smaller device would do the same job for less.
FPGA solutions by application
The same device family is designed very differently depending on the environment it has to survive. These are the applications we support most often, and the parts that suit them.
Design support Traceable supply Global shipping
Industries
Pick the environment, not just the part
Temperature grade, configuration memory type, package and lifecycle all change with the application. We shortlist against your constraints.
Capabilities
From device choice to production build
Custom board & carrier design
Carrier boards for system-on-modules, or a full custom board where a module does not fit. Prototype through to production documentation.
Thermal & power review
FPGA designs usually hit thermal limits before logic limits. We review power delivery and heat removal before the enclosure is fixed.
Second sourcing & cross-reference
Allocated or obsolete part? We propose qualified alternatives with the pin-out and toolchain differences spelled out.
Scheduled supply programmes
Production schedules with agreed release dates, buffer stock and lifecycle monitoring so your line is not exposed to a single allocation.
Bring-up support
Toolchain setup and reference-design bring-up for AMD, Altera, Lattice, Microchip and Efinix flows on hardware bought from us.
Next step
Describe your application and we will shortlist the parts
Interfaces, environment, temperature range, volume and target date — with those we can come back with a specific recommendation.
- Quotations answered within one business day
- Worldwide shipping from Shenzhen, China
- ISO 9001:2015 aligned quality process